Senior Staff Packaging Engineer in Thermal Modeling
Xilinx
(San Jose, California)Xilinx is the world’s leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs, enabling the next generation of smarter, connected, and differentiated systems and networks. Driven by the industry-wide shifts towards Cloud Computing, SDN/NFV, Video Everywhere, Embedded Vision, Industrial IoT, and 5G Wireless, Xilinx innovations enable these applications that are both, software defined, yet hardware optimized.
- Design and develops thermal models for different packages with or without thermal hardware.
- Manage thermal and mechanical simulation activities based on customer needs or internal project requirements.
- Designs engineering solutions for mechanical and thermal hardware, electronics enclosures, and production tooling based on established engineering principles and in accordance with development technology practices and guidelines.
- Creates customer recommendations and application notes based thermal models
- Develops and implements parameters and test plans for new and existing designs, including thermal designs, validation of tolerances, form/fit/function, shock and vibration, safety, reliability, developing fan curves, system power measurements.
- Collaborates and communicates with management, internal, and outsourced development partners or customers regarding design status, project progress, and issue resolution.
- Leads a project and works with engineers and internal and outsourced development partners to develop reliable, cost effective thermal solutions for moderately-complex systems.
- Represents the mechanical/thermal team for all phases of larger and more-complex development projects.
- Provides guidance and mentoring to less-experienced staff members.
- Hardware Thermal experience is highly preferred.
- 3D CAD tools and Simulation tools capability (Pro/Engineer, ANSYS, FloTherm etc...)
- Master’s or Ph.D in Engineering discipline, preferably mechanical engineering or material’s science with background in Thermal Modeling (highly preferred), Characterization and Analysis for Semiconductor Packages and Systems
- 10+ years of experience
- Knowledgeable in Thermal/Electrical/Mechanical package reliability analysis and simulation.
- Strong analytical and problem solving skills.
- Team player and ability to work across different organization.
- Strong understanding and experience in electronics packaging.
- Using 3D CAD software as a mechanical design tool.
- Using CFD and thermal mockups to validate thermal solution.
- Excellent written and verbal communication skills; mastery in English and local language. Ability to effectively communicate product architectures, design proposals and negotiate options at management levels.
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